JPH0526599B2 - - Google Patents
Info
- Publication number
- JPH0526599B2 JPH0526599B2 JP1146086A JP1146086A JPH0526599B2 JP H0526599 B2 JPH0526599 B2 JP H0526599B2 JP 1146086 A JP1146086 A JP 1146086A JP 1146086 A JP1146086 A JP 1146086A JP H0526599 B2 JPH0526599 B2 JP H0526599B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- metal
- intermediate material
- active metal
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 66
- 239000002184 metal Substances 0.000 claims description 66
- 229910000679 solder Inorganic materials 0.000 claims description 61
- 239000000463 material Substances 0.000 claims description 38
- 150000002739 metals Chemical class 0.000 claims description 15
- 238000002844 melting Methods 0.000 claims description 14
- 230000008018 melting Effects 0.000 claims description 14
- 229910045601 alloy Inorganic materials 0.000 claims description 11
- 239000000956 alloy Substances 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 3
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- 238000005253 cladding Methods 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 31
- 238000005219 brazing Methods 0.000 description 28
- 230000035882 stress Effects 0.000 description 11
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 7
- 239000000945 filler Substances 0.000 description 6
- 238000005336 cracking Methods 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 238000005275 alloying Methods 0.000 description 3
- 229910052726 zirconium Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052575 non-oxide ceramic Inorganic materials 0.000 description 1
- 239000011225 non-oxide ceramic Substances 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1146086A JPS62168694A (ja) | 1986-01-22 | 1986-01-22 | クラツドろう |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1146086A JPS62168694A (ja) | 1986-01-22 | 1986-01-22 | クラツドろう |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62168694A JPS62168694A (ja) | 1987-07-24 |
| JPH0526599B2 true JPH0526599B2 (en]) | 1993-04-16 |
Family
ID=11778704
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1146086A Granted JPS62168694A (ja) | 1986-01-22 | 1986-01-22 | クラツドろう |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62168694A (en]) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63248780A (ja) * | 1987-04-02 | 1988-10-17 | 株式会社東芝 | セラミツクス構造体 |
| JPH02217191A (ja) * | 1989-02-16 | 1990-08-29 | Tanaka Kikinzoku Kogyo Kk | セラミックス用クラッドろう材 |
| JP2594475B2 (ja) * | 1990-04-16 | 1997-03-26 | 電気化学工業株式会社 | セラミックス回路基板 |
| JPH09181423A (ja) * | 1990-04-16 | 1997-07-11 | Denki Kagaku Kogyo Kk | セラミックス回路基板 |
| JPH07108474B2 (ja) * | 1992-01-16 | 1995-11-22 | スカイアルミニウム株式会社 | ブレージングシートおよびそれを用いたろう付け方法 |
-
1986
- 1986-01-22 JP JP1146086A patent/JPS62168694A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62168694A (ja) | 1987-07-24 |
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